J.W. Osenbach: search on Z-Library

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1

Tin Whisker Test Development—Temperature and Humidity Effects Part I: Experimental Design, Observations, and Data Collection

Reynolds, H.L., Osenbach, J.W., Henshall, G., Parker, R.D., Peng Su

Journal:

IEEE Transactions on Electronics Packaging Manufacturing

Year:

2010

Language:

english

File:

PDF, 5.14 MB

english, 2010

2

Tin Whisker Test Development—Temperature and Humidity Effects Part II: Acceleration Model Development

Osenbach, J.W., Reynolds, H.L., Henshall, G., Parker, R.D., Peng Su

Journal:

IEEE Transactions on Electronics Packaging Manufacturing

Year:

2010

Language:

english

File:

PDF, 1.36 MB

english, 2010

3

Sn whiskers: material, design, processing, and post-plate reflow effects and development of an overall phenomenological theory

Osenbach, J.W., Shook, R.L., Vaccaro, B.T., Potteiger, B.D., Amin, A.N., Hooghan, K.N., Suratkar, P., Ruengsinsub, P.

Journal:

IEEE Transactions on Electronics Packaging Manufacturing

Year:

2005

Language:

english

File:

PDF, 8.69 MB

english, 2005

4

Observations of IMC Formation for Au Wire Bonds to Al Pads

John DeLucca, John Osenbach, Frank Baiocchi

Journal:

Journal of Electronic Materials

Year:

2012

Language:

english

File:

PDF, 1.47 MB

english, 2012

5

[IEEE 2011 IEEE 13th Electronics Packaging Technology Conference - (EPTC 2011) - Singapore, Singapore (2011.12.7-2011.12.9)] 2011 IEEE 13th Electronics Packaging Technology Conference - Cu wire bonding for fine pitch 40nm circuit under pad silicon integrated circuits: Development of a comprehensive robust Cu wire bonding process

Wang, BQ, Emerich, Sue, Davison, Kerry, Rossi, Nick, Osenbach, John

Year:

2011

Language:

english

File:

PDF, 1.05 MB

english, 2011

6

Phenomenological Study of the Effect of Microstructural Evolution on the Thermal Fatigue Resistance of Pb-Free Solder Joints

Coyle, R., Osenbach, J., Collins, M.N., McCormick, H., Read, P., Fleming, D., Popowich, R., Punch, J., Reid, M., Kummerl, S.

Journal:

IEEE Transactions on Components Packaging and Manufacturing Technology

Year:

2011

Language:

english

File:

PDF, 1.47 MB

english, 2011

7

Sn Corrosion and Its Influence on Whisker Growth

Osenbach, J. W., DeLucca, J. M., Potteiger, B. D., Amin, A., Shook, R. L., Baiocchi, F. A.

Journal:

IEEE Transactions on Electronics Packaging Manufacturing

Year:

2007

Language:

english

File:

PDF, 6.70 MB

english, 2007

8

Best practices for remote psychological assessment via telehealth technologies.

Luxton, David D., Pruitt, Larry D., Osenbach, Janyce E.

Journal:

Professional Psychology: Research and Practice

Year:

2014

Language:

english

File:

PDF, 9.30 MB

english, 2014

9

Diagnosis and Management of the Dandy-Walker Malformation: 30 Years of Experience

Osenbach, Richard K., Menezes, Arnold H.

Journal:

Pediatric Neurosurgery

Year:

1992

File:

PDF, 2.08 MB

1992

10

Temperature-humidity-bias behavior and acceleration factors for nonhermetic uncooled InP-based lasers

Osenbach, J.W., Evanosky, T.L., Chand, N., Comizzoli, R.B., Krautter, H.W.

Journal:

Journal of Lightwave Technology

Year:

1997

Language:

english

File:

PDF, 315 KB

english, 1997

11

Exploring the Longitudinal Trajectories of Posttraumatic Stress Disorder in Injured Trauma Survivors

Osenbach, Janyce E., Lewis, Charles, Rosenfeld, Barry, Russo, Joan, Ingraham, Leah M., Peterson, Roselyn, Wang, Jin, Zatzick, Douglas F.

Journal:

Psychiatry Interpersonal & Biological Processes

Year:

2014

Language:

english

File:

PDF, 177 KB

english, 2014

12

[IEEE 51st Electronic Components and Technology Conference 2001. Proceedings - Orlando, FL, USA (29 May-1 June 2001)] 2001 Proceedings. 51st Electronic Components and Technology Conference (Cat. No.01CH37220) - Wavelength stability of DFB lasers for non-hermetic applications

Theis, C., Jongwoo Park,, Kiely, P., Tohmon, G., Ping Wu,, Chakrabarti, U., Osenbach, J.

Year:

2001

Language:

english

File:

PDF, 988 KB

english, 2001

13

Semi-insulating silicon nitride (SinSiN) as a resistive field shield

Osenbach, J.W., Knolle, W.R.

Journal:

IEEE Transactions on Electron Devices

Year:

1990

Language:

english

File:

PDF, 644 KB

english, 1990

14

[IEEE 2000 50th Electronic Components and Technology Conference - Las Vegas, NV, USA (21-24 May 2000)] 2000 Proceedings. 50th Electronic Components and Technology Conference (Cat. No.00CH37070) - Highly accelerated life testing for non-hermetic laser modules

Theis, C.D., Siconolfi, D.J., Comizzoli, R.B., Kiely, P.A., Wu, P., Chakrabarti, U.K., Osenbach, J.W.

Year:

2000

Language:

english

File:

PDF, 1.44 MB

english, 2000

15

ENIG Corrosion Induced by Second-Phase Precipitation

John Osenbach, Ahmed Amin, Frank Baiocchi, John DeLucca

Journal:

Journal of Electronic Materials

Year:

2009

Language:

english

File:

PDF, 748 KB

english, 2009

16

Diagnosis and management of pyogenic vertebral osteomyelitis in adults

Richard K. Osenbach, Patrick W. Hitchon, Arnold H. Menezes

Journal:

Surgical Neurology

Year:

1990

Language:

english

File:

PDF, 3.69 MB

english, 1990

17

Spinal Cord Injury without Radiographic Abnormality in Children

Osenbach, Richard K., Menezes, Arnold H.

Journal:

Pediatric Neurosurgery

Year:

1989

File:

PDF, 1.63 MB

1989

18

Corrosion-induced degradation of microelectronic devices

Year:

1996

Language:

english

File:

PDF, 309 KB

english, 1996

19

Critical aspect of curing epoxy adhesive: fiber pistoning of LC connector

Jongwoo Park,, Shin, D.-S., Delucca, J., Theis, C., Osenbach, J.

Journal:

IEEE Transactions on Device and Materials Reliability

Year:

2005

Language:

english

File:

PDF, 426 KB

english, 2005

20

Tin whiskers: An illustrated guide to growth mechanisms and morphologies

Journal:

JOM Journal of the Minerals, Metals and Materials Society

Year:

2011

Language:

english

File:

PDF, 838 KB

english, 2011

21

Sn-whiskers: truths and myths

J. W. Osenbach, J. M. DeLucca, B. D. Potteiger, A. Amin, F. A. Baiocchi

Journal:

Journal of Materials Science: Materials in Electronics

Year:

2007

Language:

english

File:

PDF, 860 KB

english, 2007

22

Processability and reliability of epoxy adhesive used in microelectronic devices linked to effects of degree of cure and damp heat aging

Jongwoo Park, John Osenbach

Journal:

Microelectronics Reliability

Year:

2006

Language:

english

File:

PDF, 370 KB

english, 2006

23

[IEEE 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC) - Las Vegas, NV, USA (2010.06.1-2010.06.4)] 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC) - Cu wire bonding for fine pitch 65nm silicon integrated circuits

Low, Qwai, Osenbach, John, Yang, YongSeok, Seong, KyeongSool, Na, SeokHo

Year:

2010

Language:

english

File:

PDF, 919 KB

english, 2010

24

The corrosion behavior of BK-7 glasses for use in non-hermetic electro-optic devices

Osenbach, J.W., Fleming, D.A., Theis, C.D.

Journal:

IEEE Transactions on Components and Packaging Technologies

Year:

2000

Language:

english

File:

PDF, 174 KB

english, 2000

25

Effect of association of defects on the thermodynamic factor for diffusion

J.W. Osenbach, W.R. Bitler, V.S. Stubican

Journal:

Journal of Physics and Chemistry of Solids

Year:

1982

Language:

english

File:

PDF, 155 KB

english, 1982

26

[IEEE 2005 IEEE International Reliability Physics Symposium, 2005. Proceedings. 43rd Annual. - San Jose, CA, USA (April 17-21, 2005)] 2005 IEEE International Reliability Physics Symposium, 2005. Proceedings. 43rd Annual. - Advanced failure analysis of circuit-under-pad (CUP) structures in Cu/FSG and Cu/low K technologies

Human Wu,, Archer, V., Merchant, S.M., Cargo, J., Chesire, D., Antol, J., Mengel, R., Osenbach, J., Horvat, S., Peridier, C., White, M.

Year:

2005

Language:

english

File:

PDF, 1.41 MB

english, 2005

27

[IEEE 51st Electronic Components and Technology Conference 2001. Proceedings - Orlando, FL, USA (29 May-1 June 2001)] 2001 Proceedings. 51st Electronic Components and Technology Conference (Cat. No.01CH37220) - Epoxy adhesive used in optical fiber/passive component: kinetics, voids and reliability

Jongwoo Park,, Taweeplengsangsuke, J., Theis, C., Osenbach, J.

Year:

2001

Language:

english

File:

PDF, 600 KB

english, 2001

28

Water-Induced Corrosion of Materials Used for Semiconductor Passivation

Osenbach, J. W.

Journal:

Journal of The Electrochemical Society

Year:

1993

Language:

english

File:

PDF, 3.03 MB

english, 1993

29

Degradation of InGaAsP-InP lasers in hot-humid ambients: determination of temperature-humidity-bias acceleration factors

Osenbach, J.W., Comizzoli, R.B., Evanosky, T.L., Chand, N.

Journal:

IEEE Photonics Technology Letters

Year:

1995

Language:

english

File:

PDF, 303 KB

english, 1995

30

[IEEE 2008 58th Electronic Components and Technology Conference (ECTC 2008) - Lake Buena Vista, FL, USA (2008.05.27-2008.05.30)] 2008 58th Electronic Components and Technology Conference - Thermal degradation of sputtered Al/Ni(V)/Cu-UBM in Pb-free flip chip solder joints connected to substrate with different surface finishes

Osenbach, J., Bachman, M., Crouthamel, D., Amin, A., Weachock, R., Delucca, J., Baiocchi, F.

Year:

2008

Language:

english

File:

PDF, 2.00 MB

english, 2008

31

Giant Aneurysm of the Distal Posterior Inferior Cerebellar Artery in an ll-Month-Old Child Presenting with Obstructive Hydrocephalus

Osenbach, Richard K.

Journal:

Pediatric Neurosurgery

Year:

1989

File:

PDF, 697 KB

1989

32

Pediatric Spinal Cord and Vertebral Column Injury

Osenbach, Richard K., Menezes, Arnold H.

Journal:

Year:

1992

Language:

english

File:

PDF, 247 KB

english, 1992

33

Corrosion-induced gold-SIPOS reaction

Journal:

Materials Letters

Year:

1992

Language:

english

File:

PDF, 771 KB

english, 1992

34

[IEEE 1999 IEEE LEOS Annual Meeting Conference Proceedings. LEOS'99. 12th Annual Meeting - San Francisco, CA, USA (8-11 Nov. 1999)] 1999 IEEE LEOS Annual Meeting Conference Proceedings. LEOS'99. 12th Annual Meeting. IEEE Lasers and Electro-Optics Society 1999 Annual Meeting (Cat. No.99CH37009) - Providing more with less: the new generation small form factor transceivers

Martin, A.R., Osenbach, J.W., Nadeau, M.J., Pitman, E.A., Keska, J.P.

Year:

1999

Language:

english

File:

PDF, 147 KB

english, 1999

35

Intrathecal Drug Delivery Device Infection and Meningitis due to Mycobacterium Fortuitum: A Case Report

Hamidreza Aliabadi, Richard K. Osenbach

Journal:

Neuromodulation: Technology at the Neural Interface

Year:

2008

Language:

english

File:

PDF, 67 KB

english, 2008

36

Neurostimulation for the Treatment of Intractable Facial Pain

Richard Osenbach

Journal:

Year:

2006

Language:

english

File:

PDF, 91 KB

english, 2006

37

SPIE Proceedings [SPIE OE/LASE '94 - Los Angeles, CA (Sunday 23 January 1994)] Laser Diode Technology and Applications VI - Strategy for reliability qualification of nonhermetic laser modules

Osenbach, John W., Comizzoli, Robert B., Chen, Pei C., Johnson, Lawrence A., Temkin, Henryk

Year:

1994

Language:

english

File:

PDF, 578 KB

english, 1994

38

Complex Regional Pain Syndromes

Osenbach, Richard K

Journal:

Seminars in Neurosurgery

Year:

2004

Language:

english

File:

PDF, 140 KB

english, 2004

39

Motor Cortex Stimulation for Chronic Intractable Deafferentation Pain

Osenbach, Richard K.

Journal:

Year:

2006

Language:

english

File:

PDF, 315 KB

english, 2006

40

Ocular bobbing with ruptured giant distal posterior inferior cerebellar artery aneurysm

Richard K. Osenbach, Bennett Blumenkopf, Barbara McComb, Michael J. Huggins

Journal:

Surgical Neurology

Year:

1986

Language:

english

File:

PDF, 2.38 MB

english, 1986

41

[IEEE 2004 54th Electronic Components and Technology Conference - Las Vegas, NV, USA (1-4 June 2004)] 2004 Proceedings. 54th Electronic Components and Technology Conference (IEEE Cat. No.04CH37546) - Infrared light induced degradation of polymeric materials used in optical devices

Osenbach, J.W., Jack, C.A., Singh, D., Srinivasan, G.V., Theis, C.D.

Year:

2004

Language:

english

File:

PDF, 1.05 MB

english, 2004

42

Effects of Spinal Cord Ischemia on Evoked Potential Recovery and Postischemic Regional Spinal Cord Blood Flow

Osenbach, Richard K., Hitchon, Patrick W., Mouw, Loren, Yamada, Thoru

Journal:

Journal of Spinal Disorders & Techniques

Year:

1993

File:

PDF, 823 KB

1993

43

Neurosurgical Pain Management Volume 87 || Nontrigeminal Craniofacial Pain Syndromes

Year:

2004

Language:

english

File:

PDF, 45 KB

english, 2004

44

SYNCHRONOUS TELEHEALTH TECHNOLOGIES IN PSYCHOTHERAPY FOR DEPRESSION: A META-ANALYSIS

Osenbach, Janyce E., O'Brien, Karen M., Mishkind, Matthew, Smolenski, Derek J.

Journal:

Depression and Anxiety

Year:

2013

Language:

english

File:

PDF, 245 KB

english, 2013

45

Behavior of a-SiN:H and a-SiON:H Films in Condensed Water

Osenbach, J. W.

Journal:

Journal of The Electrochemical Society

Year:

1992

Language:

english

File:

PDF, 605 KB

english, 1992

46

[IEEE 2000 50th Electronic Components and Technology Conference - Las Vegas, NV, USA (21-24 May 2000)] 2000 Proceedings. 50th Electronic Components and Technology Conference (Cat. No.00CH37070) - The corrosion behavior of BK-7 glasses for use in non-hermetic electro-optic devices

Theis, C.D., Fleming, D.A., Osenbach, J.W.

Year:

2000

Language:

english

File:

PDF, 1.01 MB

english, 2000

47

Influence of anisotropy and doping on grain boundary diffusion in oxide systems

V.S. Stubican, J.W. Osenbach

Journal:

Solid State Ionics

Year:

1984

Language:

english

File:

PDF, 582 KB

english, 1984

48

[IEEE 2004 54th Electronic Components and Technology Conference - Las Vegas, NV, USA (1-4 June 2004)] 2004 Proceedings. 54th Electronic Components and Technology Conference (IEEE Cat. No.04CH37546) - Lead free packaging and Sn-whiskers

Osenbach, J.W., Shook, R.L., Vaccaro, B.T., Potteiger, B.D., Amin, A., Ruengsinsub, P.

Year:

2004

Language:

english

File:

PDF, 981 KB

english, 2004

49

[IEEE 2013 IEEE 63rd Electronic Components and Technology Conference (ECTC) - Las Vegas, NV, USA (2013.05.28-2013.05.31)] 2013 IEEE 63rd Electronic Components and Technology Conference - Corrosion of the Cu/Al interface in Cu-Wire-bonded integrated circuits

Osenbach, John, Wang, B Q, Emerich, Sue, DeLucca, John, Meng, Dongmei

Year:

2013

Language:

english

File:

PDF, 3.10 MB

english, 2013

50

Legal Events as Predictors of Posttraumatic Stress in Injured Trauma Survivors

Osenbach, Janyce E., Stubbs, Jennifer, Wang, Jin, Russo, Joan, Zatzick, Douglas

Journal:

Psychiatry Interpersonal & Biological Processes

Year:

2009

Language:

english

File:

PDF, 96 KB

english, 2009

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